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About this item The heat dissipation design cools at high speed, and has a number of heat dissipation holes to the stability of the machine during operation and the life of the hardware. Exquisite layout, more reasonable space. Reasonable interior design, compatible with THN-TX motherboard. SECC with 0.7MM thickness, materials, hot-dip galvanized steel plate, with high resistance, toughness and no deformation. Suitable for motherboard: MINI-ITX ultra-thin board ( 17 x 17CM), only supports motherboards with DC IN self-powered. › See more product details
The heat dissipation design cools at high speed, and has a number of heat dissipation holes to the stability of the machine during operation and the life of the hardware.
Exquisite layout, more reasonable space. Reasonable interior design, compatible with THN-TX motherboard.
SECC with 0.7MM thickness, materials, hot-dip galvanized steel plate, with high resistance, toughness and no deformation.
Suitable for motherboard MINI-ITX ultra-thin board ( 17 x 17CM), only supports motherboards with DC IN self-powered.